Accepted Manuscripts

Scott McCann, Gregory Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao Tummala and Suresh Sitaraman
J. Electron. Packag   doi: 10.1115/1.4037334
A method to determine the critical energy release rate of a peel tested sample using an energy based approach within a finite-element framework is developed. The method uses a single finite-element model, in which the external work, elastic strain energy, and inelastic strain energy are calculated as nodes along the crack interface are sequentially decoupled. The energy release rate is calculated from the conservation of energy. By using a direct, energy based approach, the method can account for large plastic strains and unloading, both of which are common in peel tests. The energy rates are found to be mesh dependent; mesh and convergence strategies are developed to determine the critical energy release rate. An example of the model is given in which the critical energy release rate of a 10 µm thick electroplated copper thin film bonded to a borosilicate glass substrate which exhibited a 3.0 N/cm average peel force was determined to be 20.9 J/m2.
TOPICS: Fracture (Materials), Energy conservation, Finite element analysis, Borosilicate glasses, Finite element model, Thin films, Copper, Heat resistant glass
Huang-Kuang Kung and Chi-Lung Hsieh
J. Electron. Packag   doi: 10.1115/1.4037276
Overhang and/or pyramid stacked packages are the trend in the semiconductor industry. As the stacked layers increase drastically, the wire sweep and wire sag problems become more and more serious. Based on some types of frequently-used stacked configurations, their corresponding wire sweep and wire sag stiffnesses and deflections are investigated for extra-high stacked layers. Two typical profiles of Q_loop and S_loop wire bonds are included in this study. However, wire sweep and wire sag have to be considered in two different design aspects. For wire sweep, we have the conclusion that the maximum wire sweep deflections always occur near the central segment of a wire bond. As for the wire sag, the maximum wire sag may take place in the center region of the straight portion of a wire bond. The result shows that the deflections of wire sag can be reduced significantly by simply shifting the position of the kink or bend created within a wire bond. Finally, we have concluded that a stacked configuration with smallest bond span may be the preferred selection for the concerns of wire sweep and wire sag issues.
TOPICS: Wire, Deflection, Semiconductor industry, Design
Zihan Wu, Junki Min, Vanessa Smet, P. Markondeya Raj, Venky Sundaram and Rao Tummala
J. Electron. Packag   doi: 10.1115/1.4037221
This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultra-thin glass substrates for RF long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and 3D double-side assembly of filters onto glass substrates. Glass with 100 µm thickness forms the core the package while four build-up layers with 15 µm thickness each are used to embed passives and form redistribution layers (RDL). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly and characterization was realized with paste-printed solder balls and reflow on PCB with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations.
TOPICS: Glass, Manufacturing, Filters, Density, Simulation, Engineering simulation, Solders

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In